A fan device includes a connector, a fan, and an attachment assembly. The fan is configured to provide cooling to circuitry when the fan receives a power signal through the connector. The attachment assembly is configured to control attachment of the fan device to a chassis within an air duct defined by the chassis. The fan defines (i) a near side which faces the circuitry, (ii) a far side which faces away from the circuitry, (iii) an airflow axis which extends from the near side to the far side along an airflow direction, and (iv) a fan profile which is substantially perpendicular to the airflow axis. The fan is disposed substantially between the electronic circuitry and the attachment assembly when the fan device attaches to the chassis within the air duct. The attachment assembly has a width which closely mirrors that of the fan profile.

 
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< Electronic device and cooling unit

> Heat dissipating device for an integrated circuit chip

> Mini-sized heat-dissipating module having an engaging structure

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