It is described a method to measure a fill level of a material by transmitting an ultrasonic or microwave signal towards a surface of the material using a level gauge arranged above the material surface, receiving in said level gauge an ultrasonic or microwave signal portion reflected from said material surface, measuring a temperature at least one measurement point between the level gauge and the material surface and determining in a calculation unit of the level gauge a temperature-corrected value of the fill level based on the time delay of the received signal portion with respect to the emitted signal and the measured temperature. To provide an improved level measuring method and system with increased reactivity and accuracy in compensating temperature variations at least one non-contact infrared thermometer is used to measure the temperature.