The present invention relates to an attach paste composition for a semiconductor package. The attach paste composition for a semiconductor package includes a mixed resin, or a blend of an elastic resin and an epoxy resin as a basic resin. At this time, preferably the basic resin includes 50 to 95 weight % of the elastic resin and 5 to 50 weight % of the epoxy resin. The present invention enables a conventional semiconductor packaging method using a die adhesive to eliminate a pre-drying process performed after application of a die adhesive through screen printing and a thermal hardening process performed after an encapsulation process, maintains the properties of the die adhesive, ensures reliability of semiconductor products, and realizes a simple process.