A method of monitoring a processing system in real-time using low-pressure based modeling techniques that include processing one or more of wafers in a processing chamber; determining a measured dynamic process response for a rate of change for a process parameter; executing a real-time dynamic model to generate a predicted dynamic process response; determining a dynamic estimation error using a difference between the predicted dynamic process response and the expected process response; and comparing the dynamic estimation error to operational limits.

 
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> Memory device and method of manufacturing the device by simultaneously conditioning transition metal oxide layers in a plurality of memory cells

> Apparatus using Manhattan geometry having non-Manhattan current flow

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