The present invention relates to a process for skinning wheat grains and to the products obtained with said process, namely skinned wheat grains and the separated outer skin fragments. It also concerns a specific installation to implement this process. The wheat grain skinning process of the invention notably comprises the following steps: a) cleaning the raw wheat grains; b) moistening the cleaned wheat grains; c) contacting the wheat grains with ozone, after or at the time as their moistening at step b); d) separating the detached outer skin fragments from the mass of grains partly or wholly skinned at step c).