A heat dissipating system comprises a computer enclosure (1), a motherboard (2), at least one dividing panel (271), at least one heat generating element, and at least one heat dissipating device. The computer enclosure has a bottom panel (11). The motherboard is mounted on and substantially parallel to the bottom panel. The at least one dividing panel is perpendicularly attached to the motherboard. The computer enclosure and the at least one dividing panel cooperatively form at least two heat dissipating chambers. The at least one heat generating element is disposed in each of the at least two chambers. The at least one heat dissipating device is disposed in each of the at least two heat dissipating chambers.