A semiconductor device for dissipating heat generated by a die during
operation and having a low height profile, a semiconductor die package
incorporating the device, and methods of fabricating the device and
package are provided. In one embodiment, the semiconductor device
comprises a thick thermally conductive plane (e.g., copper plane) mounted
on a thin support substrate and interfaced with a die. Thermally
conductive via interconnects extending through the substrate conduct heat
generated by the die from the conductive plane to conductive balls
mounted on traces on the opposing side of the substrate. In another
embodiment, the semiconductor devices comprises a thick thermally
conductive plane (e.g., copper foil) sandwiched between insulative
layers, with signal planes (e.g., traces, bonding pads) disposed on the
insulative layers, a die mounted on a first signal plane, and solder
balls mounted on bonding pads of a second signal plane. A thermally
conductive via interconnect extends through the substrate to provide a
thermal path from the die and signal plane (traces) through the thick
conductive plane and into the solder balls and external device (e.g.,
mother board). The present semiconductor device provides effective heat
dissipation without the attachment of an external heat sink or spreader.