An assembly of a semiconductor die attached to a substrate is made with a
composition comprising compounds that contain an oxazoline functionality
and an electron acceptor or an electron donor functionality. Electron
donor functionalities include styrenic, cinnamyl, and vinyl ether groups.
Electron acceptor functionalities include maleimide, acrylate, fumarate,
and maleate groups. An exemplary compound has the structure: formula (I).
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