A semiconductor device according to an embodiment of the present invention
includes a semiconductor substrate; a ferroelectric capacitor arranged
above the semiconductor substrate; an insulating protecting film covering
a side surface of the ferroelectric capacitor; and a side wall film
formed on a side surface of the ferroelectric capacitor through the
protecting film and giving tensile stress to the ferroelectric capacitor
in a direction of an electric field applied to the ferroelectric
capacitor.