The present invention relates to a method of measuring the difference in alignment between a first plan position of an element (1) and a second plan position of an element, the method comprising the use of: i) at least one rigid or taut connection (4) extending between a first point (2) at the level of the first plan position and a second point (3) at the level of the second plan position, the first and second points being at an identical displacement from the element; and ii) one or more electrolevel gauges (5) provided on the or each rigid or taut connection, so as to measure the inclination of the rigid or taut connection.