A method of electrically connecting a microelectronic component having a
first surface bearing a plurality of contacts. The method including the
steps of forming a subassembly by juxtaposing a connection component
having a support structure and a plurality of elongated posts extending
substantially parallel to one another from a first surface of the support
structure with the microelectronic component so that the support
structure overlies the surface of the component with the posts extending
away from the component and electrically connecting the posts to the
contacts of the microelectronic component.