A transparent pane, in particular a glass pane, having at least one electroconducting, non-transparent contact surface placed on one of its surfaces, to connect it by soldering to a connection piece. In the region of the soldering location, the contact surface has at least one cutout via which the soldering filler metal is visible through the pane after the connection piece has been soldered to the contact surface. Such a configuration allows reliable visual verification of the soldering locations, even in cases in which the soldering location is incorporated within a composite glazing panel and has been soldered, if necessary by induction heating.