An integrated circuit device may include a substrate, a conductive pad on
a surface of the substrate, and a conductive line on the surface of the
substrate. Moreover, the conductive line may be connected to the
conductive pad, and the conductive line may be narrow relative to the
conductive pad. In addition, an insulating layer may be provided on the
substrate, on the conductive line, and on edge portions of the conductive
pad. The insulating layer may have a hole therein exposing a central
portion of the conductive pad, and a first segment of a perimeter of the
hole may substantially define an arc of a circle around the central
portion of the conductive pad. A second segment of the perimeter of the
hole may substantially deviate from the circle around the central portion
of the conductive pad, and the second segment of the perimeter of the
hole may be adjacent a connection between the conductive line and the
conductive pad.