A charged particle beam examination equipment for examining and measuring a semiconductor wafer, comprising a wafer exchange portion for exchanging an unexamined wafer and an examiner wafer with each other, which has a first arm longitudinally sliding for reciprocation, a first wafer gripping part provided to the distal end of the first arm, for gripping/releasing the wafer, a second arm longitudinally sliding for reciprocation, and a second wafer gripping part provided to the distal end of the second arm, for gripping/releasing the wafer. The apparatus may shorten the time required for exchange of the wafers so as to enhance the throughput during examination and measurement of the wafers.