An optoelectronic system includes a printed circuit board having a ground pad and a bond pad as well as an optoelectronic element. The optoelectronic element is electrically connected to the bond pad via a bonding wire and is additionally fastened to the ground pad by a soldering connection. The ground pad is arranged such that one part of the space between the printed circuit board and the optoelectronic element is not filled with solder. Furthermore, a method is for manufacturing such an optoelectronic system.