To reduce switching noise, the power supply terminals of an integrated
circuit die are coupled to the respective terminals of at least one
embedded capacitor in a multilayer ceramic/organic hybrid substrate. In
one embodiment, a ceramic portion of the substrate includes at least one
capacitor formed of a high permittivity layer sandwiched between
conductive planes. An organic portion of the substrate includes suitable
routing and fan-out of power and signal conductors. The organic portion
includes a build-up of multiple layers of organic material overlying the
ceramic portion. Also described are an electronic system, a data
processing system, and various methods of manufacture.