A method for manufacturing an electronic component includes: cutting a wiring substrate along a line intersecting with an outline of a reinforcing member, the wiring substrate including a base substrate, a wiring pattern provided to a first surface of the base substrate, and the reinforcing member provided to a second surface of the base substrate; and attaching a reinforcing sticker to the base substrate after cutting the wiring substrate so as to cover at least a part of a crack produced in the base substrate in cutting the wiring substrate.