A reinforcement device, especially for the bottom of a bushing having a multitude of holes from which filaments, e.g., glass filaments, are drawn, including a reinforcement piece that includes a hollow first part defining at least one receiving housing and a second part that extends at least partly over the length of the hollow part, and also at least one stiffener inserted into the receiving housing of the hollow part. The cross section of the stiffener is substantially identical to the internal cross section of the hollow part.

 
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> Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

> Method and apparatus for two dimensional assembly of particles

~ 00521