A cleaning implement is provided for cleaning surfaces with a cleaning substrate. The cleaning implement includes a handle connected via a universal joint to a mop head. The mop head includes a bumper pad, which is made of a deformable and nonabsorbent material. The bumper pad can be deformed in the Z direction and within the X-Y plane. The cleaning implement can also include a motor for causing a portion of the mop head to move relative to the handle.