Nano-scale thermal management devices, methods, and systems are provided. According to some embodiments, a thermal management device configured to remove heat from a heated area can comprise an inlet port and a cavity. The cavity can be positioned intermediate a heat source and an opposing surface spaced apart from the heat source. The inlet port can receive a liquid (such as a coolant or cooling fluid) and direct the liquid to the cavity. The cavity can be configured to control the thickness of the liquid within the cavity. Liquid within the cavity can be heated by the heat source, and the opposing surface can comprise openings to allow evaporated liquid to exit the openings. A gas flow proximate the opposing surface can be used to carry vapor and be used to enhance liquid evaporation. Movement of the evaporated liquid enables heat from the heat source to be removed. The opposing surface can be a perforated membrane having micro-sized and nano-sized perforations. Other embodiments are also claimed and described.