A light-emitting diode (LED) assembly includes a circuit board (10), at
least one LED (20) being electrically connected with and being arranged
on a side of the circuit board, and a heat dissipation apparatus (40)
being arranged on an opposite side of the circuit board. The circuit
board defines at least one through hole (102) corresponding to a position
of the at least one LED. Thermal interface material (140) is filled in
the at least one hole of the circuit board to thermally interconnect the
at least one LED and the heat dissipation apparatus. The thermal
interface material is a composition of nano-material and macromolecular
material.