A socket for a semiconductor package comprises an insulating base containing a plurality of contacts, a floating board received in the insulating base, a plurality of spring members located between the insulating base and the floating board, a bottom cover pivotally assembled to an end of the insulating base, a top cover pivotally assembled to an edge of the bottom cover, a pressing board retained to the bottom cover, a heat sink module disposed on the bottom cover, and a fan mounted on the top cover.