A socket for a semiconductor package comprises an insulating base
containing a plurality of contacts, a floating board received in the
insulating base, a plurality of spring members located between the
insulating base and the floating board, a bottom cover pivotally
assembled to an end of the insulating base, a top cover pivotally
assembled to an edge of the bottom cover, a pressing board retained to
the bottom cover, a heat sink module disposed on the bottom cover, and a
fan mounted on the top cover.