A heat conductive silicone rubber composition comprising (A) an organopolysiloxane containing, on the average, at least 0.1 silicon-bonded alkenyl radical and having a viscosity of 50-100,000 mPas at 25.degree. C., (B) an organopolysiloxane containing, on the average, at least 2 SiH radicals and having a viscosity of 1-100,000 mPas at 25.degree. C., (C) a heat conductive filler, (D) a platinum catalyst, and (E) a specific organopolysiloxane having a molecular weight of at least 10,000, is easy to handle and mold, and especially smooth in flow, even when heavily loaded with the filler.