An electrical insulation tape that has a first and second carrier layer, and a dielectric thermally conductive, electrically insulative filler layer (24) that has mica particles/flakelets (6), filler particles (26) and a binder resin (28), disposed between the first and second carrier layers. The dielectric filler layer has mica flakelets (30), filler particles (32) and a binder resin. The ratio of mica flakelets to filler particles is at least 1:1 by volume, and the percentage of binder resin in the dielectric filler layer is 35-50% by volume. The first and second carrier layers are impregnated with a second resin.