Disclosed is an improved approach for performing crosstalk and signal integrity analysis in which multiple variables are taken into account when analyzing the effects of on-chip crosstalk, such as for example coupled wire length, ratio of coupling capacitance, and aggressor and victim driver types. Rather than performing a full-chip simulation, the potential crosstalk effects can be pre-characterized by performing simulation/modeling over specific net portions by systematically changing the values of these multiple variables. A set of patterns characterized from the variables are formed from the modeling. During the analysis process, the IC design is checked of the presence of the patterns, from which is produced the expected delay impact for crosstalk in the design.