The present invention provides a heat conductive silicone rubber composite
sheet that is suitable as a heat dissipating member provided between a
heat generating electronic component and a heat dissipating component
such as a heat dissipating fin, wherein the heat conductive silicone
rubber composite sheet has a laminated structure with good electrical
insulation and thermal conductivity, as well as excellent strength,
flexibility, and particularly superior interlayer adhesion. The laminated
structure has an intermediate layer and a pair of outer layers laminated
to both surfaces of the intermediate layer, wherein (A) the
intermediate layer is a layer of a synthetic resin film that displays
heat resistance and electrical insulation, and (B) the outer layers are
silicone rubber layers formed by curing a composition including (a) an
organopolysiloxane, (b) a curing agent, (c) a heat conductive filler, and
(d) a silicon compound-based adhesion imparting agent with at least one
functional group selected from the group consisting of epoxy groups,
alkoxy groups, vinyl groups, and the group represented by the formula
Si--H.