The invention provides a method of forming a resistance variable memory element and the resulting element. The method includes forming an insulating layer having an opening therein; forming a metal containing layer recessed in the opening; forming a resistance variable material in the opening and over the metal containing layer; and processing the resistance variable material and metal containing layer to produce a resistance variable material containing a diffused metal within the opening.

 
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< Semiconductor memory

> Nonvolatile memory cell, array thereof, fabrication methods thereof and device comprising the same

> Leadframe package for MEMS microphone assembly

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