A method for manufacturing a dual interface card includes at least the following step: collocating multiple card support sheets one onto the other, some of these sheets showing holes, in order to form a recess adapted to receive the dual interface module, one of the sheets supporting the antenna having solid metallic contact pads at least partially freely accessible in the recess depositing a conductive adhesive onto the contact pads positioning the dual interface module in the recess such that the pads of the module are contacting the conductive adhesive executing one single lamination step of the sheets with the module in order to: laminate the multiple layers together in order to form the card body embed the dual interface module in the recess and achieve the curing of the isotropic conductive adhesive and the permanent electrical contact between the antenna and the dual interface module.