A LED lamp includes at least one LED unit, a thermally-conductive post, a heat-dissipating module, at least one metal base, at least one cover member, at least one light reflection member, a sheath, a foundation, and a printed circuit board (PCB). The heat-dissipating module is provided with a plurality of heat sinks, each of which has one end serially connected to each other and radially arranged on an outer periphery of the thermally-conductive post, and the other end apart from each other, so as to constitute the heat-dissipating module. The sheath is used to surround and position the heat sinks, so that the heat sinks are confined. The LED unit is mounted on the metal base, which is received in a step portion formed on a central portion of each of the heat sinks. The light reflection member is provided with a curved focusing portion for focusing a light source projected by the LED unit following by outputting the light source via the cover member. The heat generated by the LED unit can be dissipated to the thermally-conductive post via the metal base, and then the heat will be dissipated from the thermally-conductive post to the heat-dissipating module constructed from the heat sinks that are in contact with the thermally-conductive post, so as to dissipate the heat to the atmosphere.