An LED chip mounting structure provided by the present invention includes a wiring board with a mounting pad an LED chip with an electrode facing the mounting pad a bump disposed between the mounting pad and the electrode to electrically connect the mounting pad to the electrode and an adhesive member for fixing the LED chip to the wiring board.

 
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> Optical coupler package

> Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member
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