Embodiments relate to an image sensor and a method of manufacturing an
image sensor. In embodiments, the method may include preparing a
semiconductor substrate formed with a plurality of photodiodes, forming
an interlayer dielectric layer on the semiconductor substrate, forming a
color filter layer on the interlayer dielectric layer, forming a planar
layer on the color filter layer, and forming micro-lenses on the planar
layer by using heat transfer liquid. Heat is uniformly applied to the
micro-lens because the micro-lens is immersed in the heat transfer liquid
having the high temperature, so the micro-lenses are prevented from being
bonded to each other. Since a curvature surface of the micro-lens may be
uniformly formed, the photo-sensitivity and color reproduction of the
image sensor may be improved, which may result in a high-quality image
sensor.