The present invention is directed to a electrical and mechanical attachment mechanism for coupling a peripheral module to a computing device. The attachment mechanism includes a set of pawls that engage with a receiving chamber thereby mechanically coupling the module to the device. The attachment mechanism also includes a set of electrical signal coupling pins. The receiving chamber includes a set of electrical signal coupling pads which interface with the electrical signal coupling pins and thereby establish electrical connectivity between the module and the device. The mechanism further includes a set of buttons for locking the pawls into a retracted position to allow the user to more easily align and couple the module to the device. The pawls are automatically released from their retracted position by a lock release pin being pressed inwardly as the module attached to the device. The locking portions on the pawl and the receiving chamber may be designed with different angles depending on a desired pullout force.