The present invention provides LTCC (low temperature co-fired ceramic)
tape compositions and demonstrates the use of said LTCC tape(s) in the
formation of Light-Emitting Diode (LED) chip carriers and modules for
various lighting applications. The present invention also provides for
the use of (LTCC) tape and LED modules in the formation of lighting
devices including, but not limited to, LED devices, High Brightness (HB)
LED backlights, display-related light sources, automotive lighting,
decorative lighting, signage and advertisement lighting, and information
display lighting.