The provided is a technology for forming a circuit for wiring, which can show a lower resistance, and particularly proposes a laminated film for wiring, which can surely decrease wiring resistance even in a large-sized liquid crystal display. The laminated film for wiring according to the present invention is characterized in that the laminated film for wiring comprises a metal layer with low resistance and an Al--Ni-based alloy layer containing 0.5 at % to 10.0 at % Ni laminated thereon. The metal layer with low resistance contains at least one or more elements among Au, Ag, Cu and Al, and has a specific resistance of 3 .mu..OMEGA.cm or less.