Automated handling systems and methods for using the handling systems for handling a work piece in a machining process, for example, an electrical discharge machining (EDM) process, are provided. The handling systems include a robotic manipulator adapted to grasp a work piece and locate the work piece in a machining operation, such as, an EDM machining operation. The robotic manipulator includes tooling having gripping devices adapted to grasp and position the work piece so that the work piece can be transferred and positioned, for example, precisely positioned, whereby accurate machining of the work piece can be practiced with little or no custom tooling. Methods for handling a work piece are also disclosed.