An adhesive sheet for laser dicing is used for dicing a workpiece into individual chips by light absorption ablation of laser beam and has at least an adhesive layer on one side of a base material which has a surface opposite to the adhesive layer having no convex parts of width (W) of 20 mm or less and height (h) of 1 .mu.m or more, or no concave parts of width (W) of 20 mm or less and depth (d) of 1 .mu.m or more.