Using thin film transistors (TFTs), an active matrix circuit, a driver
circuit for driving the active matrix circuit or the like are formed on
one substrate. Circuits such as a central processing unit (CPU) and a
memory, necessary to drive an electric device, are formed using single
crystalline semiconductor integrated circuit chips. After the
semiconductor integrated circuit chips are adhered to the substrate, the
chips are connected with wirings formed on the substrate by a chip on
glass (COG) method, a wire bonding method or the like, to manufacture the
electric device having a liquid crystal display (LCD) on one substrate.