Embodiments of an apparatus and method of monitoring and controlling a
large area substrate processing chamber are provided. Multiple types of
metrology tools can be installed in the substrate processing system to
measure film properties after substrate processing in a processing
chamber. Several number of a particular type of metrology tools can also
be installed in the substrate processing system to measure film
properties after substrate processing in a processing chamber. The
metrology tools can be installed in a metrology chamber, a process
chamber, a transfer chamber, or a loadlock.