A method for dicing a wafer having a first face in which opening are arranged along dicing streets. The method includes a step of affixing a dicing tape to the first face such that the dicing tape lies over the openings and adhesive regions of the dicing tape are exposed in the openings and a step of treating the dicing tape to reduce the adhesive strength of the adhesive regions.

 
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< Method of dicing a semiconductor device into plural chips

> Wafer with optical control modules in dicing paths

> Method and apparatus of fabricating a semiconductor device by back grinding and dicing
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