A method of manufacturing a chassis assembly to reduce electromagnetic interference is disclosed. The method includes forming a chassis having a chassis cover top portion, a chassis cover step portion, a chassis cover pre-step portion, a hemmed edge, a hemmed lip, and one or more dimpled spring fingers, by forming a first bend at the hemmed edge residing between the hemmed lip and the chassis cover pre-step portion, forming a second bend between the chassis cover step portion and the chassis cover pre-step portion, and forming a third bend between the chassis cover top portion and the chassis cover step portion. The method further including forming a fourth bends between a chassis back top portion and a chassis back. The formed chassis cover is then seated with the chassis back to create a tortuous path.