The present invention relates to a simulated wood surface covering which
is particularly useful in decking and flooring applications, said
simulated wood surface covering being comprised of strips adapted to be
interconnected aside of each other thereby forming an assembled simulated
wood surface covering of desired dimensions to cover a substrate, wherein
the strips are comprised of a simulated wood composition which is
comprised of polyvinyl chloride, a non-migrating plasticizer, and a
coloring agent, wherein the strips have sufficient flexibility to conform
to curved surfaces and to surface irregularities, wherein the upper
surface of the strips are roughened to imitate the grain structure of
wooden material, wherein the strips are void of longitudinal slots
wherein a pressure sensitive adhesive covers the underside of the strips,
and wherein the pressure sensitive adhesive is covered by a backing so
that the pressure sensitive adhesive is sandwiched between the strips and
the backing.