Embodiments of the invention provide techniques to prevent, when a bonding pad and a lead wiring pad are to be connected using a solder ball, the solder ball from deviating from a centerline and a soldering problem from occurring. In one embodiment, a head suspension assembly includes a solder ball disposed between a lead wiring pad provided for a flexure and a bonding pad provided for a slider. The solder ball is then melted for making a soldered joint between the lead wiring pad and the bonding pad. A through slot is provided at a position near a centerline on a front surface of the lead wiring pad. The solder ball is dropped into the through slot by gravity from the front surface of the lead wiring pad. A contact area in contact with the solder ball is thereby secured on a side of the slider.