A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted; a bonding agent for bonding the semiconductor chip to the die pad; a plurality of inner leads provided at the outer periphery of the die pad; outer leads extending from the inner leads; bonding wires connecting the inner leads to the semiconductor chip mounted on the die pad; and a resin for sealing the inner leads, the die pad, the semiconductor chip, the bonding agent and the bonding wires. The bonding agent is further disposed in all or part of a margin of the die pad at a peripheral portion where the semiconductor chip is mounted, and a plurality of dimples are formed in the surface of the bonding agent in the die pad margin.