Apparatuses and methods directed to a semiconductor chip package having an optical component are disclosed. Packages include a die having a light sensing region and a stress buffer on a first surface, a first opaque encapsulant having an opening therethrough disposed atop the first surface, and a second transparent or translucent encapsulant formed within the first encapsulant opening and directly atop and contacting the light sensing region. A leadless leadframe or other conductive component can be coupled to a second surface of the die. The die may also have light sensitive regions that are shielded by the first encapsulant and/or stress buffer. The stress buffer can be a layer formed at the wafer stage or a dam formed at the panel stage. A customized mold is used while dispensing the first encapsulant such that the opening therethrough is properly formed.