The present invention teaches formulations, apparatus and a method of
applying high thixotropic index polymer thick-film resistive pastes for
making polymer thick-film resistors with improved tolerances by providing
a squeegee with a blade tilted at an angle of 10.degree. to 85.degree. to
the surface of the printed circuit board thus causing a fluid rotational
motion within the bead of the polymer thick-film resistive paste as the
squeegee blade moves relative to the printed circuit board. This
rotational motion increases the shear strain rate experienced by the
paste within the bead and results in a more effective filling of the
resistor-shaped cavity without including air bubbles, experiencing
elastic recovery of the paste and, without surface fractures of the
paste.