Disclosed is a moisture-curing type curable resin composition containing: a curable resin intramolecularly having a silicon-containing functional group; and a Lewis acid or a complex of the Lewis acid as a curing catalyst, the Lewis acid being selected from the group consisting of metal halides and boron halides, which is rapidly cured at room temperature. The silicon-containing functional group is represented by general formula: --SiX.sup.1X.sup.2X.sup.3 or --SiR.sup.1X.sup.1X.sup.2 (wherein, X.sup.1, X.sup.2 and X.sup.3 respectively represent a hydrolytic group and may be the same as or different from each other, and R.sup.1 represents a substituted or unsubstituted organic group having 1 to 20 carbons). If the silicon-containing functional group is --SiR.sup.1X.sup.1X.sup.2, the curable resin further contains intramolecularly a polar component that is one of urethane, thiourethane, urea, thiourea, substituted urea, substituted thiourea, amide, and sulfide bonds, and hydroxyl, secondary amino and tertiary amino groups. Two-part type adhesive is constitutible with separating the curable resin from the curing catalyst.