A wiring board according to the present invention includes: an insulating
base 22; a plurality of first conductor wirings 23a aligned in an inner
region on the insulating base; bumps 24 formed on the respective first
conductor wirings; and a protective film 25a that is formed on the
insulating base so as to cover the first conductor wirings and has an
opening region through which the bumps are exposed. The height of at
least part of a surface of the protective film from a surface of the
insulating base is greater than the height of the bumps from the surface
of the insulating base. With this configuration, it is possible to
decrease the thickness in the state where a protective tape is placed on
the wiring board to protect bumps, thereby increasing the length of the
wiring board that can be held by a reel for supplying the wiring board.