A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below. ##STR00001## (wherein, R.sup.1 is selected from the group consisting of a hydrogen atom, and substituted or unsubstituted hydrocarbon groups of 1 to 18 carbon atoms, two or more R.sup.1 groups may be bonded together to form a cyclic structure, R.sup.2 and R.sup.3 are selected from the group consisting of a hydrogen atom, a hydroxyl group, and substituted or unsubstituted organic groups of 1 to 18 carbon atoms, two or more R.sup.2 or R.sup.3 groups may be bonded together to form a cyclic structure, YH represents an organic group of 0 to 18 carbon atoms containing one or more releasable protons (H.sup.+), and may be bonded to one or more R.sup.2 groups to form a cyclic structure, m represents an integer from 1 to 4, and p represents a number of 0 or greater).