A light emitting diode (LED) lighting module with an improved heat dissipative structure comprises a plurality of the LEDs and a heat pipe apparatus on which at least a circuit layer is provided. The circuit layer is directly formed on an electrical insulation layer with superior heat conductivity on a surface of the heat pipe apparatus. The LEDs are electrically connected to the circuit layer. Furthermore, the heat pipe apparatus can be a flat heat pipe or the combination of plate-shaped heat pipes, heat sinks and a fan. Because the LEDs are directly mounted on the surface of the heat pipe apparatus, the heat generated by the lighting LEDs is effectively delivered to the atmosphere due to the reaction of latent heat phase transformation in the heat pipe apparatus. Moreover, the heat is delivered to the heat sinks at far sides for heat exchange so that improved heat dissipation and a space saving result are achieved.