There are disclosed a photosensitive element comprising a support film which comprises a biaxially oriented polyester film and a photosensitive resin composition layer formed on one surface of the polyester film;wherein a resin layer containing fine particles is formed on the opposite surface of the support film to which the photosensitive resin composition layer is formed, and said photosensitive resin composition comprises (A) a binder polymer having a carboxyl group, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated group in the molecule, and (C) a photopolymerization initiator, a photosensitive element roll, a process for the preparation of a resist pattern using the same, the resist pattern, a resist pattern-laminated substrate, a process for the preparation of a wiring pattern and the wiring pattern.

 
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> Multilayer wiring board, manufacturing method thereof, semiconductor device, and wireless electronic device

> Multimodal polyethylene for use in single piece beverage bottle caps and closures

~ 00545